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电竞外围投注平台

      电竞外围投注平台

      (Epoxy molding compound (EMC))

      Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials that use a transfer molding system for various electronic parts. They are developed with the advanced technology cultivated through the development of silicone. They have low stress, low war页面 and high thermal conductivity characteristics.

      Shin-Etsu supplies not only general surface mounting, but also highly reliable encapsulation materials for large automotive power modules and various sensors.

      Series Name

      • KMC series

      Applications

      • Automotive parts
      • Semiconductor devices
      • Semiconductor wafers
      • Electronic components
      • Heat-resistant components
      中超外围投注官方平台
      For Inquiries About This Product
      • Company:
        Shin-Etsu Chemical Co., Ltd.
      • Department:
        Electronics Materials Division, Organic Electronics Materials Dept.
      • Phone:
        +81-3-3246-5231
          足球外围官网入口842454604272
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